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Engineering Parameters
Technical Capabilities
From rapid single-layer prototypes to complex high-density interconnect (HDI) multi-layer boards, review our exact manufacturing tolerances and production limits below.
PCB Manufacturing Capability Specifications
Full tolerance and production parameter reference for our PCB manufacturing line — covering board construction (layers, materials, drilling, routing) and finishing (trace limits, solder mask, silkscreen, and surface finishes) for every fabrication order.
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Board Specs
Physical build parameters — layers, materials, drilling & routing precision
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Base Specifications
| Layer Count | 1 to 8 Layers |
|---|---|
| Base Materials | FR4,FR-1 |
| Board Thickness | 0.8mm to 2.4mm (± 10% Tolerance) |
| Maximum Board Size | 400mm x 350mm |
| Copper Thickness | 1.0 oz to 3.0 oz (Outer & Inner) |
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Drilling & Routing
| Minimum Drill Size | 0.15mm (6 mil) |
|---|---|
| Hole Size Tolerance (PTH) | ± 0.075mm |
| Hole Size Tolerance (NPTH) | ± 0.05mm |
| Routing Tolerance | ± 0.15mm |
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Finishing & Surface
Trace limits, solder mask, silkscreen, and available surface finishes
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Tracing & Masking
| Min Trace Width / Spacing | 4 mil / 4 mil |
|---|---|
| Impedance Control Tolerance | ± 10% |
| Solder Mask Colors | Green, Blue, Red, Black, White, Yellow, Matte Black |
| Silkscreen Colors | White, Black, Yellow |
| Min Solder Mask Dam | 4 mil (0.1mm) |
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Surface Finishes
| HASL (Lead-Free) | Available (RoHS Compliant) |
|---|---|
| ENIG (Electroless Nickel Immersion Gold) | Available (1U" to 3U" Gold) |
| OSP (Organic Solderability Preservative) | Available |
| Immersion Silver / Tin | Available upon request |
| Hard Gold Plating | Available for edge connectors |