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Single-sided and double-sided with high density design handing capabilities.
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Component Library creation as per IPC standard.
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Design for Surface mount, through-hole & mixed technology with QFN,BGA, PGA & fine pitch components.
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Design as per EMI/EMC requirement.
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Design for manufacturability (DFM)
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Design for Assembly (DFA)
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Bill of material generation.
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Reverse Engineering (Bare board to design file/Gerber)
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Gerber generation
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Stack up creation for multilayer.