- Single-sided and double-sided with high density design handing capabilities.
- Component Library creation as per IPC standard.
- Design for Surface mount, through-hole & mixed technology with QFN,BGA, PGA & fine pitch components.
- Design as per EMI/EMC requirement.
- Design for manufacturability (DFM)
- Design for Assembly (DFA)
- Bill of material generation.
- Reverse Engineering (Bare board to design file/Gerber)
- Gerber generation
- Stack up creation for multilayer.